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| 1. general description the tda5051a is a modem ic, specifically dedicated to ask trans mission by means of the home power supply network, at 600 baud or 1200 baud data rate. it operates from a single 5 v supply. 2. features and benefits ? full digital carrier generation and shaping ? modulation/demodulation frequency set by cl ock adjustment, from microcontroller or on-chip oscillator ? high clock rate of 6-bit d/a (digital to an alog) converter for rejection of aliasing components ? fully integrated output power stage with overload protection ? automatic gain control (a gc) at receiver input ? 8-bit a/d (analog to digital) converter and narrow digital filtering ? digital demodulation delivering baseband data ? easy compliance with en50065-1 with simple coupling network ? few external components for low cost applications ? so16 plastic package 3. applications ? home appliance control (air conditioning, shutters, lighting, alarms and so on) ? energy/heating control ? amplitude shift keying (ask) data tran smission using the home power network tda5051a home automation modem rev. 5 ? 13 january 2011 product data sheet
tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 2 of 29 nxp semiconductors tda5051a home automation modem 4. quick reference data [1] the value of the total transmission mode current is the sum of i dd(rx/tx)(tot) + i dd(pamp) in the table 5 ? characteristics ? . [2] frequency range corresponding to the en50065-1 band. however, the modem can operate at any lower oscillator frequency. [3] the minimum value can be improved by using an external amplifier; see application diagrams figure 19 and figure 20 . 5. ordering information table 1. quick reference data symbol parameter conditions min typ max unit v dd supply voltage 4.75 5.0 5.25 v i dd(tot) total supply current f osc =8.48mhz reception mode - 28 38 ma transmission mode; data_in =0; z l =30 [1] -4768ma power-down mode - 19 25 ma f cr carrier frequency [2] - 132.5 - khz f osc oscillator frequency 6.08 - 9.504 mhz v o(rms) output carrier signal (rms value) data_in = low; z l = cispr16 120 - 122 db v v i(rms) input signal (rms value) [3] 82 - 122 db v thd total harmonic distortion on cispr16 load with coupling network - ? 55 - db t amb ambient temperature ? 50 - +100 c table 2. ordering information type number package name description version tda5051at so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 3 of 29 nxp semiconductors tda5051a home automation modem 6. block diagram fig 1. block diagram 002aaf038 1 4 7 dgnd 5 agnd 12 v dda v ddap tx_out rx_in apgnd pd 13 v ddd 311 10 9 15 14 8 2 8 u h l d 16 rom dac clock filter clock oscillator data_out osc2 osc1 digital demodulator digital band-pass filter 2 control logic d/a modulated carrier tda5051a a/d test1 scantest u/d count peak detect power drive with protection 6 data_in clk_out 5 10 6 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 4 of 29 nxp semiconductors tda5051a home automation modem 7. pinning information 7.1 pinning 7.2 pin description fig 2. pin configuration for so16 tda5051at data_in test1 data_out pd v ddd rx_in clk_out v dda dgnd agnd scantest v ddap osc1 tx_out osc2 apgnd 002aaf039 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 table 3. pin description symbol pin description data_in 1 digital data input (active low) data_out 2 digital data output (active low) v ddd 3 digital supply voltage clk_out 4 clock output dgnd 5 digital ground scantest 6 test input (l ow in application) osc1 7 oscillator input osc2 8 oscillator output apgnd 9 analog ground for power amplifier tx_out 10 analog signal output v ddap 11 analog supply voltage for power amplifier agnd 12 analog ground v dda 13 analog supply voltage rx_in 14 analog signal input pd 15 power-down input (active high) test1 16 test input (high in application) tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 5 of 29 nxp semiconductors tda5051a home automation modem 8. functional description both transmission and reception stages are co ntrolled either by the master clock of the microcontroller or by the on-chip reference osc illator connected to a crystal. this ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. the interface with the power network is made by means of an lc network (see figure 15 ). the device includes a power output stage that feeds a 120 db v (rms) signal on a typical 30 load. to reduce power consumption, the ic is disabl ed by a power-down in put (pin pd): in this mode, the on-chip osc illator remains active and the cl ock continues to be supplied at pin clk_out. for low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller, see section 8.4 ? power-down mode ? . when the circuit is connected to an external clock generator (see figure 6 ), the clock signal must be applied at pin osc1 (pin 7); osc2 (pin 8) must be left open-circuit. figure 7 shows the use of the on-chip clock circuit. all logic inputs and outputs are compatible with ttl/cmos levels, providing an easy connection to a standard microcontroller i/o port. the digital part of the ic is fully scan-testab le. two digital inputs, scantest and test1, are used for production test: these pins must be left open-circuit in functional mode (correct levels are internally define d by pull-up or pull-down resistors). 8.1 transmission mode to provide strict stability with respect to envir onmental conditions, the carrier frequency is generated by scanning the rom memory under t he control of the microcontroller clock or the reference frequency provided by the on-chip oscillator. hi gh frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling lc network and do not cause any significant disturbance. the data modulation is applied through pin data_in and smoothly applied by specific digital circuits to the carrier (shaping). harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission chann el (according to cispr16 and en50065-1 recommendations). a ? 55 db total harmonic distortion (thd) is reached when the typical lc coupling network (or an equivalent filter) is used. the dac and the power stage are set in order to provide a maximum signal level of 122 db v (rms) at the output. the output of the power stage (tx_out) must always be connected to a decoupling capacitor, because of a dc level of 0.5v dd at this pin, which is present even when the device is not transmitting. this pin must also be protected against overvoltage and negative transient signals . the dc level of tx_out can be used to bias a unipolar transient suppressor, as shown in the application diagram (see figure 15 ). direct connection to the mains is done throug h an lc network for low-cost applications. however, an hf signal transformer could be used when power-line insulation has to be performed. tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 6 of 29 nxp semiconductors tda5051a home automation modem remark: in transmission mode, the rece iving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. in this mode, the gain chosen before the beginning of the tran smission is stored, and the agc is internally set to ? 6db as long as data_in is low. then, the old gain setting is automatically restored . 8.2 reception mode the input signal received by the modem is applied to a wide range input amplifier with agc ( ? 6 db to +30 db). this is basically for noise performance improvement and signal level adjustment, which ensures a maximum sensitivity of the adc. an 8-bit conversion is then performed, followed by digital band -pass filtering, to meet the cispr16 normalization and to comply wit h some additional limitations met in current applications. after digital demodulation, the baseband data signal is made available after pulse shaping. the signal pin (rx_in) is a high-impedanc e input which has to be protected and dc decoupled for the same reasons as with pin tx_out. the high sensitivity (82 db v) of this input requires an efficient 50 hz rejection filter (realized by the lc coupling network), which also acts as an anti-aliasing filter for the internal digital processing; (see figure 15 ). 8.3 data format 8.3.1 transmission mode the data input (data_in ) is active low: this means that a burst is generated on the line (pin tx_out) when data_in pin is low. pin tx_out is in a high-impedance state as long as the device is not transmitting. successive logic 1s are treated in a non-return-to-zero (nrz) mode, see pulse shapes in figure 8 and figure 9 . 8.3.2 reception mode the data output (pin data_out ) is active low; this means that the data output is low when a burst is received. pin data_out remains low as long as a burst is received. 8.4 power-down mode power-down input (pin pd) is active high; th is means that the pow er consumption is minimum when pin pd is high. now, all func tions are disabled, except clock generation. tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 7 of 29 nxp semiconductors tda5051a home automation modem 9. limiting values 10. characteristics table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage 4.5 5.5 v f osc oscillator frequency - 12 mhz t stg storage temperature ? 50 +150 c t amb ambient temperature ? 50 +100 c t j junction temperature - 125 c table 5. characteristics v ddd =v dda =5v 5%; t amb = ? 40 c to +85 c; v ddd connected to v dda ; dgnd connected to agnd. symbol parameter conditions min typ max unit supply v dd supply voltage 4.75 5 5.25 v i dd(tot) total supply current f osc =8.48mhz reception mode - 28 38 ma transmission mode; data_in =0; z l =30 [1] -4768ma power-down mode - 19 25 ma i dd(rx/tx)(tot) total analog + digital supply current v dd =5v 5%; transmission or reception mode -2838ma i dd(pd)(tot) total analog + digital supply current v dd =5v 5%; pd = high; power-down mode -1925ma i dd(pamp) power amplifier supply current v dd =5v 5%; z l =30 ; data_in = low in transmission mode -1930ma i dd(pamp)(max) maximum power amplifier supply current v dd =5v 5%; z l =1 ; data_in = low in transmission mode -76-ma data_in and pd inputs; data_out and clk_out outputs v ih high-level input voltage 0.2v dd +0.9 - v dd +0.5 v v il low-level input voltage ? 0.5 - 0.2v dd ? 0.1 v v oh high-level output voltage i oh = ? 1.6 ma 2.4 - - v v ol low-level output voltage i ol = 1.6 ma - - 0.45 v tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 8 of 29 nxp semiconductors tda5051a home automation modem osc1 input and osc2 output (osc2 only used for driving ex ternal quartz crystal; must be left open-circuit when using an external clock generator) v ih high-level input voltage 0.7v dd -v dd +0.5 v v il low-level input voltage ? 0.5 - 0.2v dd ? 0.1 v v oh high-level output voltage i oh = ? 1.6 ma 2.4 - - v v ol low-level output voltage i ol = 1.6 ma - - 0.45 v clock f osc oscillator frequency 6.080 - 9.504 mhz f osc /f cr ratio between oscillator and carrier frequency -64- f osc /f clkout ratio between oscillator and clock output frequency -2- transmission mode f cr carrier frequency f osc =8.48mhz [2] - 132.5 - khz t su set-up time of the shaped burst f osc = 8.48 mhz; see figure 8 - 170 - s t h hold time of the shaped burst f osc = 8.48 mhz; see figure 8 - 170 - s t w(di)(min) minimum pulse width of data_in signal f osc = 8.48 mhz; see figure 8 - 190 - s v o(rms) output carrier signal (rms value) data_in = low; z l = cispr16 120 - 122 db v i o(max) power amplifier maximum output current (peak value) data_in = low; z l =1 - 160 - ma z o output impedance of the power amplifier -5- v o output dc level at pin tx_out -2.5-v thd total harmonic distortion on cispr16 load with the coupling network (measured on the first ten harmonics) v o(rms) = 121 db v on cispr16 load; f osc = 8.48 mhz; data_in =low (no modulation); see figure 3 and figure 22 - ? 55 - db b ? 20db bandwidth of the shaped output signal (at ? 20 db) on cispr16 load with the coupling network v o(rms) = 121 db v on cispr16 load; f osc = 8.48 mhz; data_in = 300 hz; duty factor = 50 %; see figure 4 - 3000 - hz table 5. characteristics ?continued v ddd =v dda =5v 5%; t amb = ? 40 c to +85 c; v ddd connected to v dda ; dgnd connected to agnd. symbol parameter conditions min typ max unit tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 9 of 29 nxp semiconductors tda5051a home automation modem [1] the value of the total transmission mode current is the sum of i dd(rx/tx)(tot) + i dd(pamp) . [2] frequency range corresponding to the en50065-1 band. however, the modem can operate at any lower oscillator frequency. [3] the minimum value can be improved by using an external amplifier; see application diagrams figure 19 and figure 20 . reception mode v i(rms) analog input signal (rms value) [3] 82 - 122 db v v i dc level at pin rx_in - 2.5 - v z i rx_in input impedance - 50 - k r agc agc range - 36 - db t c(agc) agc time constant f osc = 8.48 mhz; see figure 5 - 296 - s t d(dem)(su) demodulation delay set-up time f osc = 8.48 mhz; see figure 21 - 350 400 s t d(dem)(h) demodulation delay hold time f osc = 8.48 mhz; see figure 21 - 420 470 s b det detection bandwidth f osc =8.48mhz-3-khz ber bit error rate f osc = 8.48 mhz; 600 baud; s/n = 35 db; signal 76 db v; see figure 23 -1-1 10 ? 4 power-up timing t d(pu)(tx) delay between power-up and data_in in transmission mode xtal = 8.48 mhz; c1 = c2 = 27 pf; r p =2.2m ; see figure 10 -1- s t d(pu)(rx) delay between power-up and data_out in reception mode xtal = 8.48 mhz; c1 = c2 = 27 pf; r p =2.2m ; f rxin = 132.5 khz; 120 db v sine wave; see figure 11 -1- s power-down timing t d(pd)(tx) delay between pd = 0 and data_in in transmission mode f osc = 8.48 mhz; see figure 12 -10- s t d(pd)(rx) delay between pd = 0 and data_out in reception mode f osc = 8.48 mhz; f rxin = 132.5 khz; 120 db v sine wave; see figure 13 - 500 - s t active(min) minimum active time with t = 10 ms power-down period in reception mode f osc = 8.48 mhz; f rxin = 132.5 khz; 120 db v sine wave; see figure 14 -1- s table 5. characteristics ?continued v ddd =v dda =5v 5%; t amb = ? 40 c to +85 c; v ddd connected to v dda ; dgnd connected to agnd. symbol parameter conditions min typ max unit tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 10 of 29 nxp semiconductors tda5051a home automation modem resolution bandwidth = 9 khz; top: 0 dbv (rms) = 120 db v (rms); marker at ? 5dbv(rms)=115db v (rms); the cispr16 network provides an attenuation of 6 db, so the signal amplitude is 121 db v (rms). fig 3. carrier spectrum resolution bandwidth = 100 hz; b ? 20db = 3000 hz (2 1500 hz). fig 4. shaped signal spectrum fig 5. agc time constant definition (not to scale) 002aaf054 f (hz) 10 5 10 6 ? 60 ? 40 ? 80 ? 20 0 v o(rms) (dbv) ? 100 132.5 khz f (khz) 117.5 147.5 002aaf057 ? 40 ? 30 ? 50 ? 20 ? 10 dbv (rms) ? 60 132.5 20 db 1500 hz 002aaf05 8 v rxin v (i) 0 8.68 db agc range t c(agc) (agc time constant) +30 db ? 6 db g agc modulated sine wave 122 db v amplitude t tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 11 of 29 nxp semiconductors tda5051a home automation modem 11. timing 11.1 configuration for clock for parameter description, see table 6 . fig 6. external clock for parameter description, see table 6 . fig 7. typical configuration for on-chip clock circuit table 6. clock oscillator parameters oscillator frequency f osc carrier frequency f cr clock output frequency 1 ? 2 f osc external components 6.080 mhz to 9.504 mhz 95 khz to 148.5 khz 3.040 mhz to 4.752 mhz c1 = c2 = 27 pf to 47 pf; r p =2.2m to 4.7 m ; xtal = standard quartz crystal table 7. calculation of parameters depending on the clock frequency symbol parameter conditions unit f osc oscillator frequency with on-chip oscillator: frequency of the crystal quartz hz with external clock: frequency of the signal applied at osc1 hz f clkout clock output frequency 1 ? 2 f osc hz f cr carrier frequency/digital filter tuning frequency 1 ? 64 f osc hz t su set-up time of the shaped burst 23/f cr or 1472/f osc s t h hold time of the shaped burst 23/f cr or 1472/f osc s t w(di)(min) minimum pulse width of data_in signal t su + 1/f cr s 002aaf04 2 tda5051a 7 5 osc1 dgnd f osc clk_out gnd microcontroller xtal 002aaf04 3 tda5051a 4 5 clk_out dgnd 1 / 2 f osc clk_out gnd microcontroller 8 7 osc2 osc1 r p xtal c1 c2 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 12 of 29 nxp semiconductors tda5051a home automation modem t w(burst)(min) minimum burst time of v o(dc) signal t w(di)(min) + t h s t c(agc) agc time constant 2514/f osc s t su(demod) demodulation set-up time 3200/f osc (max.) s t h(demod) demodulation hold time 3800/f osc ( max.) s (1) t w(di) >t w(di)(min) (2) t w(di)(min) =t su +1/f cr (3) t w(di)(min) tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 14 of 29 nxp semiconductors tda5051a home automation modem fig 13. power-down sequence in reception mode fig 14. power saving by dynamic control of power-down 002aaf04 9 t d(dem)(su) t d(pd)(rx) t d(pd)(rx) data_out delayed by pd data_out rx_in pd 002aaf05 0 t active(min) i dd(rx) i dd(pd) i dd t data_out rx_in pd 0 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 15 of 29 nxp semiconductors tda5051a home automation modem 12. application information f cr = 115.2 khz for xtal = 7.3728 mhz standard crystal. fig 15. application diagram without power line insulation 250 v (ac) max t 630 ma 1 mh 68 (2 w) 47 nf/x2 250 v (ac) 47 h low r s mov 250 v (ac) 47 nf (63 v) 47 h 100 f (16 v) 470 f (16 v) 7v5 (1.3 w) 1n4006 1n4006 2 f 250 v (ac) 10 nf v ddd v ddap apgnd agnd dgnd v dda rx_in tx_out sa5.0a 1 f (16 v) 14 1 +5 v +5 v 2 micro- controller 4 7 osc1 xtal 7.3728 mhz 2.2 m osc2 85 9 12 3 3 1 2 13 11 15 47 nf 78l05 pd 27 pf 27 pf 10 data_in data_out clk_out tda5051a 002aaf059 u tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 16 of 29 nxp semiconductors tda5051a home automation modem a. gain b. input impedance f cr = 115.2 khz; l = 47 h; c = 47 nf. main features of the coupling network: 50 hz reject ion > 80 db; anti-aliasing for the digital filter > 50 db at the sampling frequency ( 1 ? 2 f osc ). input impedance always higher than 10 within the 95 khz to 148.5 khz band. fig 16. gain (a) and input impedance (b) of the coupling network 002aaf055 f (hz) 10 10 7 10 6 10 5 10 2 10 4 10 3 ? 60 ? 20 20 g (db) ? 100 002aaf431 f (hz) 10 10 7 10 6 10 5 10 2 10 4 10 3 10 2 10 3 z i ( ) 10 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 17 of 29 nxp semiconductors tda5051a home automation modem with coupling network; l = 47 h; c = 47 nf. fig 17. output voltage as a function of line impedance f cr = 115.2 khz for xtal = 7.3728 mhz standard crystal. fig 18. application diagram with power line insulation 002aaf056 z line ( ) 110 2 10 110 120 130 v o (db v) 100 250 v (ac) max t 630 ma 100 (0.5 w) 470 nf/x2 250 v (ac) 47 h low r s mov 250 v (ac) 100 nf 22 h 100 f (16 v) 470 f (16 v) 10 nf v ddd v ddap apgnd agnd dgnd v dda rx_in tx_out sa5.0a 1 f (16 v) 14 1 +5 v +5 v 2 micro- controller 4 7 osc1 xtal 7.3728 mhz 2.2 m osc2 85 9 12 3 3 1 2 13 11 15 47 nf 78l05 pd 27 pf 27 pf 10 data_in data_out clk_out tda5051a 002aaf060 (63 v) 100 newport/ murata 78250 5 6 1 2 230 v 6 v 1 va fdb08 + ? u tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 18 of 29 nxp semiconductors tda5051a home automation modem f cr = 115.2 khz for xtal = 7.3728 mhz standard crystal. fig 19. application diagram without power line insulation, with improved sensitivity (68 db v typ.) 250 v (ac) max t 630 ma 1 mh 68 (2 w) 47 nf/x2 250 v (ac) 47 h low r s mov 250 v (ac) 47 nf (63 v) 47 h 100 f (16 v) 470 f (16 v) 7v5 (1.3 w) 1n4006 1n4006 2 f 250 v (ac) 10 nf v ddd v ddap apgnd agnd dgnd v dda rx_in tx_out sa5.0a 1 f (16 v) 14 1 +5 v +5 v 2 micro- controller 4 7 osc1 xtal 7.3728 mhz 2.2 m osc2 85 9 12 3 3 1 2 13 11 15 47 nf 78l05 pd 27 pf 27 pf 10 data_in data_out clk_out tda5051a 002aaf0 61 bc547b 1 k 10 k 150 k 33 k 10 nf u tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 19 of 29 nxp semiconductors tda5051a home automation modem f cr = 115.2 khz for xtal = 7.3728 mhz standard crystal. fig 20. application diagram with power line insulation, with improved sensitivity (68 db v typ.) 250 v (ac) max t 630 ma 100 (0.5 w) 470 nf/x2 250 v (ac) 47 h low r s mov 250 v (ac) 100 nf 22 h 100 f (16 v) 470 f (16 v) 10 nf v ddd v ddap apgnd agnd dgnd v dda rx_in tx_out 1 f (16 v) 14 1 +5 v +5 v 2 micro- controller 4 7 osc1 xtal 7.3728 mhz 2.2 m osc2 85 9 12 3 3 1 2 13 11 15 47 nf 78l05 pd 27 pf 27 pf 10 data_in data_out clk_out tda5051a 002aaf062 (63 v) 100 newport/ murata 78250 5 6 1 2 230 v 6 v 1 va fdb08 + ? sa5.0a bc547b 1 k 10 k 150 k 33 k 10 nf u tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 20 of 29 nxp semiconductors tda5051a home automation modem 13. test information fig 21. test set-up for measuring demodulation delay (1) square wave ttl signal 300 hz, duty factor = 50 % for measuring signal bandwidth (see figure 3 ). (2) data_in + low for measuring tota l harmonic distortion (see figure 3 ). (3) tuned for f cr = 132.5 khz. (4) the cispr16 network provides a ? 6 db attenuation. fig 22. test set-up for measuring thd and bandwidth of the tx_out signal 30 1 f 10 nf xtal data_in data_out t d(dem)(su) t d(dem)(h) data_out data_in tx_out/rx_in oscilloscope y1 tda5051a (to be tested) pulse generator 300 hz 50 % y2 tx_out rx_in f osc 2 1 10 14 78 002aaf051 g 002aaf05 2 tda5051a power supply spectrum analyzer 50 10 7 8 osc1 osc2 12, 5, 9 1 13, 3, 11 tx_out agnd, dgnd, apgnd v dda , v ddd , v ddap 5 50 10 f 33 nf 250 nf 47 h 50 h 33 nf 47 h coupling network (3) cispr16 network (4) +5 v (2) (1) data_in g 250 nf 5 50 h 002aaf05 2 tda5051a power supply spectrum analyzer 50 10 7 8 osc1 osc2 12, 5, 9 1 13, 3, 11 tx_out agnd, dgnd, apgnd v dda , v ddd , v ddap 5 50 10 f 33 nf 250 nf 47 h 50 h 33 nf 47 h coupling network (3) cispr16 network (4) +5 v (2) (1) data_in g 250 nf 5 50 h tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 21 of 29 nxp semiconductors tda5051a home automation modem (1) see figure 22 . fig 23. test set-up for measur ing bit error rate (ber) 002aaf053 tda5051a (to be tested) coupling network (1) v24/ttl interface 78 78 14 2 data_out data_in rx_in out tda5051a spectrum analyzer 50 white noise generator 10 12, 5, 9 12, 5, 9 1 osc1 osc2 osc1 osc2 tx_out in agnd, dgnd, apgnd agnd, dgnd, apgnd v24 serial data analyzer parameters 600 baud pseudo random sequence: 2 9 ? 1 bits long data_in data_out rxd txd xtal = 8.48 mhz out in out coupling network (1) + + tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 22 of 29 nxp semiconductors tda5051a home automation modem 14. package outline fig 24. package outline sot162-1 (so16) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale s o16: plastic small outline package; 16 leads; body width 7.5 mm sot162 -1 99-12-27 03-02-19 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 23 of 29 nxp semiconductors tda5051a home automation modem 15. handling information all input and output pins are protected ag ainst electrostatic discharge (esd) under normal handling. when handling ensure that the appropriate precautions are taken as described in jesd625-a or equivalent standards. 16. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 16.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 16.3 wave soldering key characteristics in wave soldering are: tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 24 of 29 nxp semiconductors tda5051a home automation modem ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities 16.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 25 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 9 and 10 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 25 . table 9. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 10. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 25 of 29 nxp semiconductors tda5051a home automation modem for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 17. abbreviations msl: moisture sensitivity level fig 25. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 11. abbreviations acronym description adc analog-to-digital converter agc automatic gain control ask amplitude shift keying cmos complementary metal-oxide semiconductor dac digital-to-analog converter hf high-frequency i/o input/output ic integrated circuit lc inductor-capacitor filter nrz non-return-to-zero rms root mean squared rom read-only memory thd total harmonic distortion ttl transistor-transistor logic tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 26 of 29 nxp semiconductors tda5051a home automation modem 18. revision history table 12. revision history document id release date data sheet status change notice supersedes tda5051a v.5 20110113 product data sheet - tda5051a v.4 modifications: ? table 1 ? quick reference data ? , t amb , ambient temperature: ? min value changed from ? 10 c to ? 50 c ? max value changed from +80 c to +100 c ? table 4 ? limiting values ? , t amb , ambient temperature: ? min value changed from ? 10 c to ? 50 c ? max value changed from +80 c to +100 c ? table 5 ? characteristics ? , descriptive line below title is changed from ?t amb =0 c to 70 c? to ?t amb = ? 40 c to +85 c? tda5051a v.4 20100701 product data sheet - tda5051a v.3 tda5051a v.3 20100422 preliminary data sheet - tda5051a v.2 tda5051a v.2 (9397 750 05035) 19990531 product specification - tda5051a v.1 tda5051a v.1 (9397 750 02571) 19970919 product specification - - tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 27 of 29 nxp semiconductors tda5051a home automation modem 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 19.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 19.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. tda5051a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 13 january 2011 28 of 29 nxp semiconductors tda5051a home automation modem quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 19.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 20. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors tda5051a home automation modem ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 13 january 2011 document identifier: tda5051a please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 transmission mode . . . . . . . . . . . . . . . . . . . . . 5 8.2 reception mode . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3 data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3.1 transmission mode . . . . . . . . . . . . . . . . . . . . . 6 8.3.2 reception mode . . . . . . . . . . . . . . . . . . . . . . . . 6 8.4 power-down mode . . . . . . . . . . . . . . . . . . . . . . 6 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11.1 configuration for clock . . . . . . . . . . . . . . . . . . 11 11.2 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 13 12 application information. . . . . . . . . . . . . . . . . . 15 13 test information . . . . . . . . . . . . . . . . . . . . . . . . 20 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 22 15 handling information. . . . . . . . . . . . . . . . . . . . 23 16 soldering of smd packages . . . . . . . . . . . . . . 23 16.1 introduction to soldering . . . . . . . . . . . . . . . . . 23 16.2 wave and reflow soldering . . . . . . . . . . . . . . . 23 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 16.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 26 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 27 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 27 19.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 19.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28 20 contact information. . . . . . . . . . . . . . . . . . . . . 28 21 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 |
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